| San Diego Facility Equipment List | |||||||||||||||||||||||||||||||||||||||
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AOI: 3 Machines
Inspection Equipment - Mantis Scopes: Quantity: 3 - ScienceScope MAC PK3-ED-X Inspection System PDM Lab Equipment - Programmers for Different Processors - Gang Chip Programmers - Bed of Nail Test Equipment - In Circuit Programming Pick and Place Equipment: 6 Machines (4 SMT lines) - Philips Topaz - Quantity: 3 - Philips Topaz-X - Quantity: 2 - Philips Topaz-XII - Quantity: 1 Printed Circuit Board Depanelizer - Olamef USA Depanelizer Printers: 5 Machines - MPM UP-400 - Quantity: 4 - Dek 248
-Vitronics Ovens - 8 Zones - Quantity: 2 -BTU VIP-98 - 7 Zones - Quantity: 1 -BTU-VIP-70 - 5 Zones - Quantity: 1 Rework Equipment: - BGA Rework Station - Conceptronics Freedom 2000 - Hakko Rework Station Model 803 |
Software - Altium - PCAD-2006 - Cadence - PADs - Solidworks - Pedyn-2000 - Unisoft - N-Computing Modules for Paperless Production Floor
Procedure Access Standard Production Tools: - Hakko Soldering Stations - Pace Soldering Stations - Mantis Scopes X-Ray: - ScienceScope 1800 Washer: - New Trident III Aqueous Batch Washer (purchased 2009) - Stencil Washer (Purchased 2009) - In Line CL (Closed Loop) Water System WaveSoldering Machine - Technical Devices - Nu-Era Junior - Selective Soldering Machine (pending for delivery)
Wire Prep Equipment - Molex Crimp Machine - Komax Delta 60 Wire Stripper - Cosmic 30M Wire Stripper
Budgeted For 2011/2012: - New Philips Pick and Place MG-1, Chip on Chip Capable - 1 Additional Printer - 1 Additional AOI Machine - Mirtec MVP-7 - 1 In Line Washer |
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| Mexico Facility Equipment List |
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| General: Total of 5 SMT Line. Capacity of 3M shots per day (2 shifts) Minimum component size 0201 Fine Pitch .2 mm, BGA, Micro BGA SMT: A) Pick and place:
B) Epoxy Dispenser:
C) Printers:
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D) Reflow:
E) Inspection: Solder Paste, X-Ray, AOI
F) Processes: Centrifuge solder paste mixer. Malcolm SPS-I Ultrasonic stencil cleaner in SITU SAWA |
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